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ArticleName Density and liquidus temperature of high-copper slag fusion
ArticleAuthor Lukavyy S. L., Fedorov A. N., Khabiev M. P., Khabiev P. P.

National University of Science and Technology “Moscow Institute of Steel and Alloys” (MISIS), Moscow, Russia:

S. L. Lukavyy, Assistant, e-mail:
A. N. Fedorov, Professor of a Chair of Non-Ferrous Metals and Gold
M. P. Khabiev, Assistant
R. P. Khabiev, Post-Graduate Student


Determination method of high-temperature density is developed for chemical-active slag fusion of Cu2O – Fe2O3 – SiO2 – CaO – (Al2O3) system. Density measuring is performed for slags with high content of copper (9.7–27.2%) in temperature range from 1250 to 1400 oС. Density is one of the important features of the slag system, that defines the structural composition of fusion and is needed for calculation of other physical and chemical parameters: molar volume, surface tension and thermal expansion coefficient. There is obtained the regression equation for description of density of high-copper synthetic slag fusion in functional dependence of copper content and temperature. This allows to estimate the slag’s density of copper matte’s continual converting with high level of reliability. There are determined the coefficients of thermal expansion of slags and its dependence on copper content in fusion. Liquidus temperatures for all composition of studied slags are obtained via differential thermal analysis (DTA). Obtained data is interesting for developing of continual converting technology for copper mattes with application of Vanukov’s process and could be interesting for other types of bubble process. As well as the dynamic viscosity of density and liquidus temperatures of high-copper slag system, the additional data of it is needed for reasonable solutions of slag conditions for copper mattes’ continual converting, and for defining range of stable process’ behavior and construction of furnace (under-tuyer zone, outflow and construction of the transit equipment).

keywords Density, liquidus temperature, copper oxide, high-copper slag, differential thermal analysis, Vanukov’s process, blister copper

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